CI Wafer Fab I Plant, Winbond Electronics Corp.
The CI Wafer Fab I Plant is located in the Hsinchu Science-Based Industrial Park. The building is a long span pre-stressed RC structure with one floor below grade and two floors above. The total floor area is 9,751 square meters. The construction cost of the building and structure was approximately NT$160,000,000. The plant houses facilities that produces six-inch wafers. The basement contains training classrooms and the cafeteria. The ground and second floor contains the production facilities, mechanical equipment, offices, warehouse, and testing facilities. The project was completed in October, 1988.